Q: Translated ZDNet Germany Thoroughbred site with heat numbers (http://translate.google.com/translate?u=http% 3A% 2F% 2F0%% 2Fstory 2Fnews.zdnet.de% 2C% 2C00% 2Ct101-s2104794. html u0026; long pair 7Cen u0026 =% u0026 hl = en prev =% 2Flanguage_tools)
DOesnt look pretty . 10% overall drop from XP chip, but it is 0.1 V lower . 1.65
an XP chip is roughly the same “warmth” as a thoroughbred of the same speed 1.65V.
now the really ugly part. Thoroughbred cores are rumored to have been 80sq mm. Current XP cores are 128 cm 2 / m2 mms.
Wattage a thorougbred is about 75. Wattage per square inch of an XP chip is about 52.
Meaning, the thoroughbred, if these numbers prove true, contact the heatsink surface material interface, the lack of harm, lack of heatsink damage as much more critical than with an XP chip making. .
Some food for thought for those waiitng for a thoroughbred before upgrading . overclockign that it may end up with a t-bred is harder than overclocking with a XP.
Mike
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Re:Theres definitely an IHS on the Hammer series of chips, but I thought AMD were going to leave it out of the thoroughbred?
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Re:<<
<< And the other problem with the heatspreader is if they use cheap thermal grease between the core and the spreader, which is what they did with their K6-x processors. I've popped some open – it's a grey rubbery substance. >>
I think the grey thermal compound is Aluminum oxide thermal compound. I don't know if anyone sells that crap anymore… I still have a syringe of it from www.coolerguys.com 
IMO, an IHS just adds another thermal impedance to the equation… everything is better without an IHS. >>
hmmm I can imagine people posting many many many.. "HELP!! I cracked my Thoroughbred!!!, how do I commit fraud without getting caught? I want to blame my boo-boo on AMD"
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Re:<< And the other problem with the heatspreader is if they use cheap thermal grease between the core and the spreader, which is what they did with their K6-x processors. I've popped some open – it's a grey rubbery substance. >>
I think the grey thermal compound is Aluminum oxide thermal compound. I don't know if anyone sells that crap anymore… I still have a syringe of it from www.coolerguys.com
IMO, an IHS just adds another thermal impedance to the equation… everything is better without an IHS.
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Re:And the other problem with the heatspreader is if they use cheap thermal grease between the core and the spreader, which is what they did with their K6-x processors. I've popped some open – it's a grey rubbery substance. The spreader is glued at the corners, and some of the glue is put right on the core.
I had an idea awhile back to put something like a small integrated "shim" around the processor. There's already that greenish sealant around the core; well I had an idea for AMD to build that up so that it would surround the core at just the right level – it would act as a shim permanently attached to the processor. No core chipping, and less heat-transfer problems.
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Re:<< Now if only we could sandwich the die between two heatsinks… >>
Heh, I was rummaging around AMD's site and I learned something (:D): AMD mobile CPUs are sandwiched between two heatsinks. :Q Or they can be, anyway. Methodologies for Measuring Temperature on AMD Athlon? and AMD Duron? Processors (http://www.amd.com/us-en/assets/content_type/white_papers_and_tech_docs/24228.pdf) On the bottom of page 64 edit: 'scuse me, I meant top of page 65, sorry, it shows a side view of their setup. I've never had a laptop apart… anyone know if this is a new practice or not?
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Re:Premium thermal grease is going to be even more important.
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Re:Now if only we could sandwich the die between two heatsinks… it seems remarkable already when I look at the die of a Tbird and realize that the heatsink has to pull about 60W through that tiny area. The heat spreader will solve the problem of cracking the die, of course, but it adds another thermal interface to the stack (die>TIM1>spreader>TIM2>heatsink, rather than die>TIM>heatsink).
Maybe AMD will think outside the box. I wonder if they could encapsulate some heat-pipe fluid under the spreader with the die, to move heat out to the edges of the spreader more efficiently.
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Re:yeah, a heat spreader isn't going to solve the heat problems iwth it…. you're still taking about a very sizeable heat contact surface reduction without a sizeable heat output reduction….
Mike
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Re:A heatspreader would solve the problem of cracked cores, but not heat. The contact area the core has with the heatspeader is still the same as the contact area it would have directly with a heatsink.
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Re:Aren't the new athlons going to have heat spreaders on them? I thought I read somewhere that they were. With the die shrink they almost have to. That should solve the problem of core cracking and heat dispertion.
Re:Interesting read. Thank you. Guess we will have to see what happens when these get into the real world and the temps range from 25c-60c with everyone!
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